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Case Study: Cleanroom Film & Bags – FOUP Packaging Using High-Density Resin
When a top semiconductor manufacturer needed a more reliable way to protect its FOUPs during storage and global transit, Cleanroom Film & Bags delivered. By designing a custom high-density polyethylene (HDPE) packaging solution, CFB helped eliminate moisture ingress, prevent surface damage, and meet strict cleanroom standards—setting a new benchmark for FOUP packaging in the industry.
Jun 4


Cleanroom Film & Bags Announces CFB CleanTronics Advanced Packaging for Semiconductors and Microelectronics
We've expanded our line of CFB CleanTronics Advanced Packaging for semiconductors, silicon wafers, and microchips.
Mar 26, 2024


Cleanroom Film & Bags Adds Capacity to Serve Increasing Demand for Cleanroom Nylon Films and Bags
CFB expanded its operations to meet a dramatic increase in demand for nylon packaging 5/10/2023 Cleanroom Film and Bags (CFB), a division...
May 10, 2023
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