Case Study: Cleanroom Film & Bags – FOUP Packaging Using High-Density Resin

FOUP Packaging Client Overview

A leading semiconductor manufacturer needed a custom packaging solution for transporting and storing Front Opening Unified Pods (FOUPs), which are used to house and protect 300mm silicon wafers in cleanroom environments.

Challenge

The client’s FOUPs are high-value, precision components that must remain free of scratches, particulates, and moisture during storage and global transport. The existing packaging allowed for minor surface abrasions and occasional condensation buildup, both unacceptable in high-purity semiconductor environments.

Key requirements included:

• Scratch prevention on FOUP surfaces

• Moisture barrier protection to prevent corrosion and outgassing

• Cleanroom compatibility (Class 100)

• Durability during shipping and handling

Solution

Cleanroom Film & Bags (CFB) collaborated with the client’s packaging engineering team to design a custom FOUP bag using high-density polyethylene (HDPE) film, tailored to meet all cleanroom and material handling requirements.

Material Selection

• High-Density Polyethylene (HDPE) resin was chosen due to:

• High stiffness and strength, offering excellent puncture and tear resistance

• Low coefficient of friction, minimizing surface abrasion

• Superior moisture barrier properties compared to lower density resins

• Non-linting and low outgassing, critical for cleanroom environments

• Cost Effective HDPE is generally more affordable than alternative materials while still providing excellent performance.

Bag Design Features

• Double-bagging system: Inner and outer HDPE bags with different thicknesses (4 mil inner, 6 mil outer) to provide layered protection

• Antistatic additives: Incorporated into the resin to dissipate static electricity and prevent particle attraction

• Custom form-fit shape: Designed to conform closely to the FOUP contours, reducing movement within the bag and further minimizing scratch risk

Cleanroom Manufacturing

CFB produced the bags in a Class 100 cleanroom, ensuring:

• Zero particulate contamination

• Consistent quality control across production batches

• Double packaging in cleanroom-safe liners for immediate integration into the client’s packaging process

Results

After implementing the new HDPE packaging solution:

• Zero FOUP surface damage incidents were reported over a 12-month shipping and handling cycle

• Moisture ingress was eliminated, validated through relative humidity monitoring inside test packs

• Packaging waste was reduced by 18% due to optimized bag sizing and materials

• Compliance with SEMI E62 (standard for FOUP cleanliness and handling) was achieved consistently

Client Feedback

“CFB’s custom HDPE FOUP bags exceeded our expectations in every key metric—cleanliness, protection, and usability. Their technical expertise helped us redesign our packaging for better performance and less waste.”

Conclusion

Cleanroom Film & Bags successfully developed a high-performance FOUP packaging solution using HDPE resin, setting a benchmark for cleanroom-compatible protective packaging in the semiconductor industry. This case highlights the importance of materials science, precision engineering, and collaboration in solving advanced packaging challenges.

Please reach out to sales@cleanbags.com with any inquiries and further options to successfully met your packaging challenge.