PLACENTIA, Calif., March 26, 2024 — Cleanroom Film & Bags (CFB), a division of C-P Flexible Packaging, has expanded its CFB CleanTronics Advanced Packaging line for semiconductors and microelectronics.
This advanced packaging supports a wide range of applications, including silicon wafers, microchips, printed circuit boards, motherboards, integrated circuits, microprocessors, fiber optics, and other sensitive electronic components.
With over 35 years of experience, Cleanroom Film & Bags has been a leader in developing low outgassing films and advanced packaging materials for electronics. Every stage of manufacturing—from raw materials to finished vacuum-sealed products—is completed in an ISO 14644-1 Class 6 cleanroom environment.
CFB CleanTronics packaging can be produced to meet Level 50 or Level 100 IEST and NASA cleanliness standards.
CFB manufactures CleanTronics packaging using domestically sourced barefoot resin in one of the few vertically integrated cleanroom packaging facilities in the United States.
Jaime Read, General Manager of Cleanroom Film & Bags, emphasized the company’s long-standing expertise in packaging for microelectronics and critical components, noting that the entire manufacturing process is designed to meet the highest cleanliness standards. She also highlighted the use of American-made virgin resins as part of CFB’s commitment to quality.
To learn more about CFB CleanTronics Advanced Packaging, visit www.cleanroomfilm.com/electronic-packaging or contact sales@cleanbags.com.